The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 18, 2022

Filed:

Mar. 25, 2020
Applicant:

Bruker Nano, Inc., Santa Barbara, CA (US);

Inventors:

Edward R. Ratner, Minneapolis, MN (US);

Andrew George Reid, San Jose, CA (US);

Assignee:

Bruker Nano, Inc., Santa Barbara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06K 1/00 (2006.01); G06T 7/00 (2017.01); G06K 9/62 (2022.01);
U.S. Cl.
CPC ...
G06T 7/001 (2013.01); G06K 9/6269 (2013.01); G06T 2207/20081 (2013.01); G06T 2207/20084 (2013.01); G06T 2207/30148 (2013.01);
Abstract

The present disclosure provides methods and apparatus for rapidly classifying detected defects in subcomponents of a manufactured component or device. The defect classification may occur after defect detection or, because the classification may be sufficiently rapid to be performed in real-time, during defect detection, as part of the defect detection process. In an exemplary implementation, the presently-disclosed technology may be utilized to enable real-time classification of detected defects in multiple subcomponents of the component in parallel. The component may be, for example, a multi-chip package with silicon interposers, and the subcomponents may include, for example, through-silicon vias and solder joints. Defects in subcomponents of other types of components may be also be classified. One embodiment relates to a method of classifying detected defects in subcomponents of a manufactured component. Another embodiment relates to a product manufactured using a disclosed method of inspecting multiple subcomponents of a component for defects.


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