The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 18, 2022

Filed:

Feb. 11, 2020
Applicant:

Applied Materials, Inc., Santa Clara, CA (US);

Inventors:

Halbert Chong, San Jose, CA (US);

Lei Zhou, San Jose, CA (US);

Adolph Miller Allen, Oakland, CA (US);

Vaibhav Soni, Sunnyvale, CA (US);

Kishor Kalathiparambil, San Jose, CA (US);

Vanessa Faune, Sacramento, CA (US);

Song-Moon Suh, San Jose, CA (US);

Assignee:

Applied Materials, Inc., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C23C 14/54 (2006.01); H01J 37/34 (2006.01); C23C 14/35 (2006.01); C23C 14/06 (2006.01);
U.S. Cl.
CPC ...
C23C 14/54 (2013.01); C23C 14/0605 (2013.01); C23C 14/35 (2013.01); H01J 37/3405 (2013.01); H01J 37/3426 (2013.01); H01J 37/3467 (2013.01); H01J 37/3455 (2013.01); H01J 2237/002 (2013.01); H01J 2237/332 (2013.01);
Abstract

Physical vapor deposition methods for reducing the particulates deposited on the substrate are disclosed. The pressure during sputtering can be increased to cause agglomeration of the particulates formed in the plasma. The agglomerated particulates can be moved to an outer portion of the process chamber prior to extinguishing the plasma so that the agglomerates fall harmlessly outside of the diameter of the substrate.


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