The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 11, 2022
Filed:
Mar. 14, 2019
Taiwan Semiconductor Manufacturing Company Ltd., Hsinchu, TW;
Ming-Ho Tsai, Hsinchu, TW;
Jyun-Hong Chen, Taichung, TW;
Chun-Chen Liu, Kaohsiung, TW;
Yu-Nu Hsu, Tainan, TW;
Peng-Ren Chen, Hsinchu, TW;
Wen-Hao Cheng, Hsinchu, TW;
Chi-Ming Tsai, Taipei, TW;
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD., Hsinchu, TW;
Abstract
A semiconductor device manufacturing method including: simultaneously forming a plurality of conductive bumps respectively on a plurality of formation sites by adjusting a forming factor in accordance with an environmental density associated with each formation site; wherein the plurality of conductive bumps including an inter-bump height uniformity smaller than a value, and the environmental density is determined by a number of neighboring formation sites around each formation site in a predetermined range.