The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 11, 2022
Filed:
Sep. 07, 2017
Applicant:
Acm Research (Shanghai) Inc., Shanghai, CN;
Inventors:
Hui Wang, Shanghai, CN;
Jian Wang, Shanghai, CN;
Zhaowei Jia, Shanghai, CN;
Hongchao Yang, Shanghai, CN;
Assignee:
ACM RESEARCH (SHANGHAI) INC., Shanghai, CN;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/687 (2006.01); H01L 21/673 (2006.01); H01L 21/288 (2006.01); H01L 21/285 (2006.01); H01L 21/445 (2006.01); H01L 21/479 (2006.01);
U.S. Cl.
CPC ...
H01L 21/687 (2013.01); H01L 21/288 (2013.01); H01L 21/2885 (2013.01); H01L 21/28562 (2013.01); H01L 21/445 (2013.01); H01L 21/479 (2013.01); H01L 21/6732 (2013.01); H01L 21/67326 (2013.01);
Abstract
A plating chuck for holding a substrate during plating processes, wherein the substrate has a notch area () and a patterned region () adjacent to the notch area (). The plating chuck comprises a cover plate () configured to cover the notch area () of the substrate to shield the electric field at the notch area () when the substrate is being plated.