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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11461266 B1

PDFFull Text
Date of Patent:
Oct. 04, 2022

Filed:

Aug. 15, 2019

Computation-in-memory in three-dimensional memory device

Applicant:

Yangtze Memory Technologies Co., Ltd., Wuhan, CN;

Inventors:

Shengwei Yang, Wuhan, CN;

Zhongyi Xia, Wuhan, CN;

Kun Han, Wuhan, CN;

Assignee:

YANGTZE MEMORY TECHNOLOGIES CO., LTD., Wuhan, CN;

Attorney:

Bayes PLLC

Primary Examiner:

Courtney P Carmichael-Moody

Int. Cl.
CPC ...
G06F 15/78 (2006.01); G06F 3/06 (2006.01); G11C 16/04 (2006.01); G11C 16/10 (2006.01); G11C 16/26 (2006.01); H01L 27/11526 (2017.01); H01L 27/11556 (2017.01); H01L 27/11573 (2017.01); H01L 27/11582 (2017.01);
U.S. Cl.
CPC ...
G06F 15/7821 (2013.01); G06F 3/061 (2013.01); G06F 3/0655 (2013.01); G06F 3/0679 (2013.01); G11C 16/0483 (2013.01); G11C 16/10 (2013.01); G11C 16/26 (2013.01); H01L 27/11526 (2013.01); H01L 27/11556 (2013.01); H01L 27/11573 (2013.01); H01L 27/11582 (2013.01);
Abstract

Three-dimensional (3D) memory devices are provided. An exemplary 3D memory device includes a 3D NAND memory array and an on-die data processing circuit coupled to the 3D NAND memory array on a same chip. The on-die data processing circuit is configured to receive, from an input/output (I/O) interface, control instructions for performing operations on data stored in the 3D NAND memory array. The on-die data processing circuit is also configured to retrieve the data from the 3D NAND memory array based on the control instructions and perform the operations on the retrieved data. Moreover, the on-die data processing circuit is configured to return a result of the operations to the I/O interface.

Find Patent Forward Citations

Yang, Shengwei. (2022). Computation-in-memory in three-dimensional memory device (U.S. Patent No. 11461266). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11461266

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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