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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11456116 B1

PDFFull Text
Date of Patent:
Sep. 27, 2022

Filed:

Mar. 30, 2017

Magnetic coils in locally thinned silicon bridges and methods of assembling same

Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

Andreas Augustin, Munich, DE;

Bernd Waidhas, Pettendorf, DE;

Sonja Koller, Regensburg, DE;

Reinhard Mahnkopf, Oberhaching, DE;

Georg Seidemann, Landshut, DE;

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:

Schwegman Lundberg & Woessner, P.A.

Primary Examiner:

Tuyen T Nguyen

Int. Cl.
CPC ...
H01F 27/24 (2006.01); H01F 41/04 (2006.01); H01F 17/00 (2006.01); H01L 23/64 (2006.01); H01L 27/01 (2006.01); H01L 49/02 (2006.01);
U.S. Cl.
CPC ...
H01F 41/046 (2013.01); H01F 17/0006 (2013.01); H01F 27/24 (2013.01); H01L 23/645 (2013.01); H01L 27/016 (2013.01); H01L 28/10 (2013.01); H01F 2017/0066 (2013.01); Y10T 428/32 (2015.01);
Abstract

A recess in a die backside surface occupies a footprint that accommodates an inductor coil that is formed in metallization above an active surface of the die. Less semiconductive material is therefore close to the inductor coil. A ferromagnetic material is formed in the recess, or a ferromagnetic material is formed on a dielectric layer above the inductor coil. The recess may extend across a die that allows the die to be deflected at the recess.

Find Patent Forward Citations

Augustin, Andreas. (2022). Magnetic coils in locally thinned silicon bridges and methods of assembling same (U.S. Patent No. 11456116). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11456116

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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