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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11444045 B1

PDFFull Text
Date of Patent:
Sep. 13, 2022

Filed:

Aug. 16, 2020

Bonding structures of semiconductor devices

Applicant:

Globalfoundries Singapore Pte. Ltd., Singapore, SG;

Inventors:

Ramasamy Chockalingam, Singapore, SG;

Juan Boon Tan, Singapore, SG;

Xiaodong Li, Singapore, SG;

Kai Chong Chan, Singapore, SG;

Ranjan Rajoo, Singapore, SG;

Assignee:

GlobalFoundries Singapore Pte. Ltd., Singapore, SG;

Attorney:

Anthony Canale

Primary Examiner:

Niki H Nguyen

Int. Cl.
CPC ...
H01L 23/08 (2006.01); H01L 23/52 (2006.01); H01L 29/40 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 24/05 (2013.01); H01L 24/45 (2013.01); H01L 2224/03013 (2013.01); H01L 2224/0355 (2013.01); H01L 2224/03464 (2013.01); H01L 2224/04042 (2013.01); H01L 2224/05147 (2013.01); H01L 2224/05547 (2013.01); H01L 2224/05556 (2013.01); H01L 2224/05571 (2013.01); H01L 2224/05573 (2013.01); H01L 2224/05647 (2013.01); H01L 2224/45147 (2013.01);
Abstract

A semiconductor device is provided that includes a bond pad, an insulating layer, and a bonding structure. The bond pad is in a dielectric layer and the insulating layer is over the bond pad; the insulating layer having an opening over the bond pad formed therein. The bonding structure electrically couples the bond pad in the opening. The bonding structure has a height that at least extends to an upper surface of the insulating layer.

Find Patent Forward Citations

Chockalingam, Ramasamy. (2022). Bonding structures of semiconductor devices (U.S. Patent No. 11444045). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11444045

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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