logo

For the Inventor, By the Inventor

The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11441053 B1

PDFFull Text
Date of Patent:
Sep. 13, 2022

Filed:

Aug. 21, 2019

Composition for forming adhesive film for imprinting, adhesive film, laminate, method for producing cured product pattern, and method for manufacturing circuit substrate

Applicant:

Fujifilm Corporation, Tokyo, JP;

Inventors:

Naoya Shimoju, Haibara-gun, JP;

Akinori Shibuya, Haibara-gun, JP;

Yuichiro Goto, Haibara-gun, JP;

Assignee:

FUJIFILM Corporation, Tokyo, JP;

Attorney:

Sughrue Mion, PLLC

Primary Examiner:

Wenwen Cai

Int. Cl.
CPC ...
C09J 7/30 (2018.01); C09J 5/00 (2006.01); C09J 133/14 (2006.01); C09J 133/04 (2006.01); C08L 33/14 (2006.01); C08L 33/04 (2006.01); B32B 3/26 (2006.01); B32B 7/12 (2006.01); B32B 9/00 (2006.01); B32B 9/04 (2006.01); B32B 27/30 (2006.01); B32B 37/12 (2006.01); B32B 37/15 (2006.01); B32B 38/00 (2006.01); H01L 21/027 (2006.01); B29C 59/02 (2006.01); B29K 105/00 (2006.01); G03F 7/00 (2006.01);
U.S. Cl.
CPC ...
C09J 7/30 (2018.01); B32B 3/263 (2013.01); B32B 7/12 (2013.01); B32B 9/005 (2013.01); B32B 9/045 (2013.01); B32B 27/308 (2013.01); B32B 37/1207 (2013.01); B32B 37/15 (2013.01); B32B 38/0008 (2013.01); C08L 33/04 (2013.01); C08L 33/14 (2013.01); C09J 5/00 (2013.01); C09J 133/04 (2013.01); C09J 133/14 (2013.01); H01L 21/0271 (2013.01); B29C 59/02 (2013.01); B29K 2105/0097 (2013.01); B32B 2250/02 (2013.01); B32B 2255/26 (2013.01); B32B 2305/72 (2013.01); B32B 2310/0806 (2013.01); B32B 2315/02 (2013.01); B32B 2333/08 (2013.01); B32B 2457/08 (2013.01); C09J 2203/326 (2013.01); C09J 2301/416 (2020.08); C09J 2301/502 (2020.08); C09J 2433/00 (2013.01); G03F 7/0002 (2013.01);
Abstract

There are provided a composition for forming an adhesive film for imprinting having excellent adhesiveness and wettability, an adhesive film, a laminate, a method for producing a cured product pattern, and a method for manufacturing a circuit substrate. A composition for forming an adhesive film for imprinting contains a resin having a polymerizable group; and a solvent, in which the resin has at least one kind of a repeating unit derived from a polymerizable compound having a C log P value less than or equal to 0, and solubility of the resin in water at 25° C. is greater than or equal to 1 mass %, provided that the C log P value is a coefficient showing affinity of an organic compound with respect to water and 1-octanol.

Find Patent Forward Citations

Loading…