The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 06, 2022
Filed:
Mar. 29, 2019
Intel Corporation, Santa Clara, CA (US);
Georgios Dogiamis, Chandler, AZ (US);
Aleksandar Aleksov, Chandler, AZ (US);
Telesphor Kamgaing, Chandler, AZ (US);
Gilbert W. Dewey, Beaverton, OR (US);
Hyung-Jin Lee, Portland, OR (US);
Intel Corporation, Santa Clara, CA (US);
Abstract
Embodiments may relate to an semiconductor package. The semiconductor package may include a die coupled with the face of the package substrate. The semiconductor package may further include a waveguide coupled with the face of the package substrate adjacent to the die, wherein the waveguide is to receive an electromagnetic signal from the die and facilitate conveyance of the electromagnetic signal in a direction parallel to the face of the package substrate. Other embodiments may be described or claimed.