The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 06, 2022

Filed:

Feb. 23, 2017
Applicant:

Semiconductor Components Industries, Llc, Phoenix, AZ (US);

Inventors:

Yusheng Lin, Phoenix, AZ (US);

Roger Paul Stout, Chandler, AZ (US);

Chee Hiong Chew, Seremban, MY;

Sadamichi Takakusaki, Ota, JP;

Francis J. Carney, Mesa, AZ (US);

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01); H01L 23/14 (2006.01); H01L 23/31 (2006.01); H01L 21/56 (2006.01); H01L 23/00 (2006.01); H01L 23/15 (2006.01); C04B 37/02 (2006.01); H01L 23/373 (2006.01); H01L 23/538 (2006.01); H01L 21/48 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49548 (2013.01); C04B 37/021 (2013.01); H01L 21/565 (2013.01); H01L 23/142 (2013.01); H01L 23/15 (2013.01); H01L 23/3107 (2013.01); H01L 23/3121 (2013.01); H01L 23/3735 (2013.01); H01L 23/49568 (2013.01); H01L 23/49575 (2013.01); H01L 23/5385 (2013.01); H01L 24/72 (2013.01); C04B 2237/34 (2013.01); C04B 2237/343 (2013.01); C04B 2237/402 (2013.01); C04B 2237/406 (2013.01); C04B 2237/407 (2013.01); C04B 2237/52 (2013.01); C04B 2237/64 (2013.01); C04B 2237/82 (2013.01); H01L 21/4857 (2013.01); H01L 21/4871 (2013.01); H01L 23/49586 (2013.01); H01L 23/5389 (2013.01); H01L 24/19 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/29111 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/73253 (2013.01); H01L 2224/83801 (2013.01); H01L 2924/0002 (2013.01); H01L 2924/1033 (2013.01); H01L 2924/10272 (2013.01); H01L 2924/1203 (2013.01); H01L 2924/13055 (2013.01); H01L 2924/13091 (2013.01); H01L 2924/181 (2013.01);
Abstract

Implementations of semiconductor packages may include a metallic baseplate, a first insulative layer coupled to the metallic baseplate, a first plurality of metallic traces, each metallic trace of the first plurality of metallic traces coupled to the electrically insulative, one or more semiconductor devices coupled to each one of the first plurality of metallic traces, a second plurality of metallic traces coupled to the one or more semiconductor devices, and a second insulative layer coupled to the metallic traces of the second plurality of metallic traces.


Find Patent Forward Citations

Loading…