The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 06, 2022

Filed:

Jun. 23, 2020
Applicant:

The Research Foundation for the State University of New York, Albany, NY (US);

Inventors:

Douglas Coolbaugh, Albany, NY (US);

Douglas La Tulipe, Albany, NY (US);

Gerald Leake, Albany, NY (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G02B 6/12 (2006.01); H01L 21/48 (2006.01); H01L 23/498 (2006.01); H01L 31/02 (2006.01); H01L 31/0232 (2014.01); G02B 6/13 (2006.01); G02B 6/42 (2006.01); H01L 23/00 (2006.01); G02B 6/43 (2006.01); H01L 27/12 (2006.01); H01L 21/18 (2006.01); H01L 21/762 (2006.01); H01L 25/18 (2006.01); H01L 25/00 (2006.01); H01L 25/065 (2006.01);
U.S. Cl.
CPC ...
G02B 6/12002 (2013.01); G02B 6/131 (2013.01); G02B 6/4232 (2013.01); G02B 6/43 (2013.01); H01L 21/187 (2013.01); H01L 21/486 (2013.01); H01L 23/49838 (2013.01); H01L 24/92 (2013.01); H01L 27/1266 (2013.01); H01L 31/02002 (2013.01); H01L 31/02016 (2013.01); H01L 31/02327 (2013.01); G02B 6/12 (2013.01); G02B 6/12004 (2013.01); G02B 2006/121 (2013.01); G02B 2006/12038 (2013.01); G02B 2006/12061 (2013.01); G02B 2006/12138 (2013.01); G02B 2006/12147 (2013.01); G02B 2006/12176 (2013.01); G02B 2006/12178 (2013.01); H01L 21/7624 (2013.01); H01L 21/76224 (2013.01); H01L 23/49816 (2013.01); H01L 23/49827 (2013.01); H01L 24/08 (2013.01); H01L 24/16 (2013.01); H01L 24/24 (2013.01); H01L 24/80 (2013.01); H01L 24/81 (2013.01); H01L 24/82 (2013.01); H01L 25/0657 (2013.01); H01L 25/18 (2013.01); H01L 25/50 (2013.01); H01L 27/1203 (2013.01); H01L 2224/03002 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/05008 (2013.01); H01L 2224/05025 (2013.01); H01L 2224/05582 (2013.01); H01L 2224/08225 (2013.01); H01L 2224/09181 (2013.01); H01L 2224/11002 (2013.01); H01L 2224/16145 (2013.01); H01L 2224/24105 (2013.01); H01L 2224/24226 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/80896 (2013.01); H01L 2224/81191 (2013.01); H01L 2224/8203 (2013.01); H01L 2224/9202 (2013.01); H01L 2224/9222 (2013.01); H01L 2224/94 (2013.01); H01L 2225/06513 (2013.01); H01L 2225/06541 (2013.01); H01L 2924/0002 (2013.01); H01L 2924/1431 (2013.01);
Abstract

There is set forth herein an optoelectrical system comprising: a conductive path for supplying an input voltage to a photonics device, wherein the conductive path comprises a base structure through via extending through a substrate and a photonics structure through via, the photonics structure through via extending through a photonics device dielectric stack. There is set forth herein an optoelectrical system comprising: a second structure fusion bonded to an interposer base dielectric stack of a first structure. There is set forth herein a method comprising: fabricating a second wafer built structure using a second wafer, the second wafer built structure defining a photonics structure and having a photonics device integrated into a photonics device dielectric stack of the second wafer based structure; and wafer scale bonding the second wafer built structure to a first wafer built structure.


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