The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 30, 2022
Filed:
Mar. 17, 2020
Samsung Electronics Co., Ltd., Suwon-si, KR;
Kwangnam Kim, Suwon-si, KR;
Nohsung Kwak, Suwon-si, KR;
Sungyeon Kim, Jeongeup-si, KR;
Hyungjun Kim, Suwon-Si, KR;
Haejoong Park, Yongin-Si, KR;
Jongwoo Sun, Hwaseong-si, KR;
Sangrok Oh, Yongin-si, KR;
Ilyoung Han, Uiwang-si, KR;
Jungpyo Hong, Gwangmyeong-si, KR;
SAMSUNG ELECTRONICS CO., LTD., Suwon-si, KR;
Abstract
A semiconductor manufacturing apparatus including at least one load module including a load port on which a substrate container is located, a plurality of substrates being mountable on the substrate container; at least one loadlock module including a loadlock chamber directly connected to the substrate container, the loadlock chamber interchangeably having atmospheric pressure and vacuum pressure, a first transfer robot within the loadlock chamber, and a substrate stage within the loadlock chamber, the plurality of substrates being mountable on the substrate stage; a transfer module including a transfer chamber connected to the loadlock chamber, a second transfer robot within the transfer chamber, and a substrate aligner within the transfer chamber; and at least one process module including at least one process chamber connected to the transfer module.