The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 30, 2022

Filed:

Jul. 09, 2020
Applicant:

Bruker Nano, Inc., Santa Barbara, CA (US);

Inventors:

David Lewis Adler, San Jose, CA (US);

Scott Joseph Jewler, San Jose, CA (US);

Assignee:

Bruker Nano, Inc., Santa Barbara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06T 7/00 (2017.01); G06N 20/00 (2019.01); G06T 5/00 (2006.01); G01N 23/04 (2018.01); G01T 1/20 (2006.01); H05K 1/11 (2006.01); H05K 3/40 (2006.01); H01L 21/67 (2006.01); G06F 30/398 (2020.01); G01N 23/083 (2018.01); G01N 23/18 (2018.01); G06K 9/62 (2022.01); G06F 119/18 (2020.01); G06F 115/12 (2020.01);
U.S. Cl.
CPC ...
G06T 7/0014 (2013.01); G01N 23/04 (2013.01); G01N 23/043 (2013.01); G01N 23/083 (2013.01); G01N 23/18 (2013.01); G01T 1/20 (2013.01); G06F 30/398 (2020.01); G06K 9/6256 (2013.01); G06K 9/6267 (2013.01); G06N 20/00 (2019.01); G06T 5/007 (2013.01); G06T 7/0012 (2013.01); H01L 21/67288 (2013.01); H05K 1/115 (2013.01); H05K 3/4038 (2013.01); G01N 2223/04 (2013.01); G01N 2223/401 (2013.01); G01N 2223/426 (2013.01); G01N 2223/505 (2013.01); G01N 2223/6466 (2013.01); G06F 2115/12 (2020.01); G06F 2119/18 (2020.01); G06T 2207/10081 (2013.01); G06T 2207/10116 (2013.01); G06T 2207/20024 (2013.01); G06T 2207/20081 (2013.01); G06T 2207/20208 (2013.01); G06T 2207/30004 (2013.01);
Abstract

In one embodiment, an X-ray inspection system may capture one or more X-ray images for samples of interest processed by a first tool. The X-ray inspection system may be inline with the first tool and have an inspection speed of 300 mmper minute or greater. The system may determine, in real-time, metrology information related to the samples of interest based on the X-ray images. The metrology information may indicate that a sample parameter associated with the samples of interest is outside of a pre-determined range. The system may provide instructions or data to one or more of the first tool or one or more second tools to adjust process parameters associated with the respective tools based on metrology information. The adjusted process parameters may reduce a processing error probability, of the respective tool for processing subsequent samples, related to the sample parameter being outside of the pre-determined range.


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