The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 23, 2022

Filed:

Jul. 30, 2020
Applicant:

Infineon Technologies Ag, Neubiberg, DE;

Inventors:

Alexander Heinrich, Bad Abbach, DE;

Ralf Otremba, Kaufbeuren, DE;

Stefan Schwab, Regensburg, DE;

Assignee:

Infineon Technologies AG, Neubiberg, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 29/45 (2006.01);
U.S. Cl.
CPC ...
H01L 24/83 (2013.01); H01L 24/05 (2013.01); H01L 24/29 (2013.01); H01L 24/32 (2013.01); H01L 29/45 (2013.01); H01L 2224/2912 (2013.01); H01L 2224/29105 (2013.01); H01L 2224/29109 (2013.01); H01L 2224/29111 (2013.01); H01L 2224/29113 (2013.01); H01L 2224/29116 (2013.01); H01L 2224/29139 (2013.01); H01L 2224/29147 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/32503 (2013.01); H01L 2224/32507 (2013.01); H01L 2224/8302 (2013.01); H01L 2224/83022 (2013.01); H01L 2224/8346 (2013.01); H01L 2224/8381 (2013.01); H01L 2224/83191 (2013.01); H01L 2224/83418 (2013.01); H01L 2224/83423 (2013.01); H01L 2224/83439 (2013.01); H01L 2224/83444 (2013.01); H01L 2224/83447 (2013.01); H01L 2224/83449 (2013.01); H01L 2224/83455 (2013.01); H01L 2224/83464 (2013.01); H01L 2224/83469 (2013.01); H01L 2224/83471 (2013.01); H01L 2224/83472 (2013.01); H01L 2224/83486 (2013.01); H01L 2224/83493 (2013.01); H01L 2224/83815 (2013.01); H01L 2224/83825 (2013.01); H01L 2924/01327 (2013.01);
Abstract

An arrangement is disclosed. In one example, the arrangement of a conductor and an aluminum layer soldered together comprises a substrate and the aluminum layer disposed over the substrate. The aluminum forms a first bond metal. An intermetallic compound layer is disposed over the aluminum layer. A solder layer is disposed over the intermetallic compound layer, wherein the solder comprises a low melting majority component. The conductor is disposed over the solder layer, wherein the conductor has a soldering surface which comprises a second bond metal. The intermetallic compound comprises aluminum and the second bond metal and is predominantly free of the low melting majority component.


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