The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 09, 2022
Filed:
Jul. 30, 2021
Global Unichip Corporation, Hsinchu, TW;
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Pei Yu, Hsinchu, TW;
Yung-Sheng Fang, Hsinchu, TW;
Chang-Ming Liu, Hsinchu, TW;
Igor Elkanovich, Hsinchu, TW;
Global Unichip Corporation, Hsinchu, TW;
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Abstract
An electronic system, an integrated circuit die and an operation method thereof are provided. The integrated circuit die includes a plurality of interface circuit slices and a merging circuit. The transmission data stream sent from the transmitter die is split into a plurality of sub-data streams. Each of the interface circuit slices provides a physical layer to receive the corresponding one of the sub-data streams. The merging circuit is coupled to the interface circuit slices to receive the sub-data streams. The merging circuit merges the sub-data streams from the interface circuit slices back to the original data corresponding to the transmission data stream to be provided to an application layer. The merging circuit aligns the sub-data streams from the interface circuit slices in timing to mitigate different delays of the interface circuit slices.