The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 09, 2022
Filed:
Sep. 17, 2020
Applicant:
Infineon Technologies Ag, Neubiberg, DE;
Inventors:
Gert Pfahl, Munich, DE;
Daniel Bolowski, Moehnsee, DE;
Marian Sebastian Broll, Soest, DE;
Michael Kreuz, Schwerte, DE;
Evelyn Napetschnig, Diex, AT;
Holger Schulze, Villach, AT;
Stefan Woehlert, Villach, AT;
Assignee:
Infineon Technologies AG, Neubiberg, DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); C22C 21/10 (2006.01); C22C 21/16 (2006.01); C22C 21/02 (2006.01);
U.S. Cl.
CPC ...
H01L 24/05 (2013.01); C22C 21/02 (2013.01); C22C 21/10 (2013.01); C22C 21/16 (2013.01); H01L 24/03 (2013.01); H01L 2224/0345 (2013.01); H01L 2224/04042 (2013.01); H01L 2224/0517 (2013.01); H01L 2224/05118 (2013.01); H01L 2224/05123 (2013.01); H01L 2224/05124 (2013.01); H01L 2224/05139 (2013.01); H01L 2224/05147 (2013.01); H01L 2224/05149 (2013.01); H01L 2224/05163 (2013.01); H01L 2224/05166 (2013.01); H01L 2924/0103 (2013.01); H01L 2924/0104 (2013.01); H01L 2924/01012 (2013.01); H01L 2924/01013 (2013.01); H01L 2924/01014 (2013.01); H01L 2924/01021 (2013.01); H01L 2924/01022 (2013.01); H01L 2924/01025 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/01047 (2013.01); H01L 2924/3512 (2013.01);
Abstract
A semiconductor substrate has a bond pad. The bond pad includes a layer of an aluminum alloy having a chemical composition including at least 0.3% by weight of at least one of Zn, Mg, Sc, Zr, Ti, Ag and/or Mn, with the balance being at least Al and incidental impurities.