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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11410834 B1

PDFFull Text
Date of Patent:
Aug. 09, 2022

Filed:

Jun. 13, 2019

Substrate processing method

Applicant:

Tokyo Electron Limited, Tokyo, JP;

Inventors:

Keiichi Tanaka, Nirasaki, JP;

Tatsuo Matsudo, Nirasaki, JP;

Assignee:

TOKYO ELECTRON LIMITED, Tokyo, JP;

Attorneys:

Nath, Goldberg & Meyer

Jerald L. Meyer

Primary Examiner:

Thomas T Pham

Int. Cl.
CPC ...
H01L 21/306 (2006.01); H01J 37/32 (2006.01); C23C 14/06 (2006.01); C23C 14/10 (2006.01); C23C 14/22 (2006.01); H01L 21/02 (2006.01); H01L 21/285 (2006.01);
U.S. Cl.
CPC ...
H01J 37/32568 (2013.01); C23C 14/0652 (2013.01); C23C 14/10 (2013.01); C23C 14/221 (2013.01); H01L 21/022 (2013.01); H01L 21/02274 (2013.01); H01L 21/28568 (2013.01); H01J 37/32091 (2013.01); H01J 2237/332 (2013.01); H01L 21/0217 (2013.01); H01L 21/02164 (2013.01);
Abstract

A substrate processing apparatus of the present disclosure includes a processing container capable of being vacuum-exhausted, a lower electrode, and an upper electrode. A target substrate can be placed on the lower electrode. The upper electrode is disposed in the processing container so as to face the lower electrode. A substrate processing method of the present disclosure includes performing a first process on the target substrate using an AC voltage without using a DC pulse voltage, and performing a second process on the target substrate using the DC pulse voltage.

Find Patent Forward Citations

Tanaka, Keiichi. (2022). Substrate processing method (U.S. Patent No. 11410834). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11410834

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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