The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 26, 2022
Filed:
Sep. 24, 2020
Samsung Electronics Co., Ltd., Suwon-si, KR;
Kyungdon Mun, Hwaseong-si, KR;
Myungsam Kang, Hwaseong-si, KR;
Youngchan Ko, Seoul, KR;
Yieok Kwon, Hwaseong-si, KR;
Jeongseok Kim, Cheonan-si, KR;
Gongje Lee, Seoul, KR;
Bongju Cho, Hwaseong-si, KR;
Samsung Electronics Co., Ltd., Suwon-si, KR;
Abstract
A semiconductor package includes a core member having a first surface and a second surface opposing each other, and an external side surface between the first and second surfaces, the core member having a through-hole connecting the first and second surfaces, having a protruding portion that protrudes from the external side surface, and having a surface roughness (Ra) of 0.5 μm or more, a redistribution substrate on the first surface of the core member, and including a redistribution layer; a semiconductor chip in the through-hole on the redistribution substrate, and having a contact pad electrically connected to the redistribution layer, and an encapsulant on the redistribution substrate, and covering the semiconductor chip and the core member, the protruding portion of the core member having a surface exposed to a side surface of the encapsulant.