The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 19, 2022

Filed:

Aug. 28, 2020
Applicant:

Taiwan Semiconductor Manufacturing Co., Ltd., Hsin-Chu, TW;

Inventors:

Seiji Takahashi, Hsinchu, TW;

Jhy-Jyi Sze, Hsin-Chu, TW;

Tzu-Hsiang Chen, Xihu Township, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/146 (2006.01); H01L 21/02 (2006.01);
U.S. Cl.
CPC ...
H01L 27/1463 (2013.01); H01L 21/0262 (2013.01); H01L 21/02639 (2013.01); H01L 27/1464 (2013.01); H01L 27/14603 (2013.01); H01L 27/14689 (2013.01);
Abstract

The present disclosure relates to a CMOS image sensor having a pixel device on a deep trench isolation (DTI) structure, and an associated method of formation. In some embodiments, the DTI structure is disposed at a peripheral of a pixel region, extending from a back-side of the substrate to a position within the substrate. A pixel device is disposed at the front-side of the substrate directly overlying the DTI structure. The pixel device comprises a pair of source/drain regions disposed within the substrate and reaching on a top surface of the DTI structure. A second trench isolation structure is disposed from the front-side at an inner peripheral of the first trench isolation structure. The first trench isolation structure has a top surfaces locating at a position of the substrate vertically exceeding bottom surfaces of the second trench isolation structure.


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