The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 19, 2022

Filed:

May. 16, 2017
Applicant:

Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;

Inventors:

Yii-Cheng Lin, Hsinchu, TW;

Chih-Ming Sun, New Taipei, TW;

Pinyen Lin, Rochester, NY (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/67 (2006.01); B08B 9/08 (2006.01); H01L 21/306 (2006.01);
U.S. Cl.
CPC ...
H01L 21/67161 (2013.01); B08B 9/08 (2013.01); H01L 21/30604 (2013.01); H01L 21/6719 (2013.01); H01L 21/67063 (2013.01); H01L 21/67207 (2013.01);
Abstract

A semiconductor processing device includes a first etching chamber, a second etching chamber, and an etching module. The etching module is adapted to interchangeably contain the first etching chamber or the second etching chamber for wafer etching. A semiconductor process using the semiconductor processing device is also provided.


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