The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 19, 2022
Filed:
Sep. 25, 2018
Applicant:
Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;
Inventors:
Shen-Nan Lee, Hsinchu County, TW;
Te-Chien Hou, Kaohsiung, TW;
Teng-Chun Tsai, Hsinchu, TW;
Chung-Wei Hsu, Hsinchu County, TW;
Chen-Hao Wu, Keelung, TW;
Assignee:
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD., Hsinchu, TW;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B24B 53/017 (2012.01); B24B 49/12 (2006.01); B24B 49/00 (2012.01); B24B 37/32 (2012.01);
U.S. Cl.
CPC ...
B24B 53/017 (2013.01); B24B 37/32 (2013.01); B24B 49/003 (2013.01); B24B 49/12 (2013.01);
Abstract
A method is provided and includes: measuring a surface profile of a polishing pad; obtaining a reference profile of the polishing pad; comparing the surface profile of the polishing pad with the reference profile to generate a difference result; determining a conditioning parameter value according to the difference result; and conditioning the polishing pad using the conditioning parameter value.