The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 12, 2022

Filed:

Feb. 18, 2021
Applicant:

Kla Corporation, Milpitas, CA (US);

Inventors:

Farhat Quli, Union City, CA (US);

Paul A. Konicek, Milpitas, CA (US);

Assignee:

KLA Corporation, Milpitas, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01N 21/93 (2006.01); G03F 7/20 (2006.01); G01N 21/95 (2006.01);
U.S. Cl.
CPC ...
G01N 21/93 (2013.01); G01N 21/9505 (2013.01); G03F 7/70516 (2013.01);
Abstract

A reference substrate for calibrating high-energy inspection systems includes permanently affixed particle-emulating and/or integral void-type environmentally inert surface features that emulate particles/defects having sizes below about 18 nm. Particle-emulating surface features are fabricated directly onto the substrate's surface (or an intervening barrier film layer) using e-beam lithography or over-etch processing. Void-type defect features having sizes below 18 nm are etched into the substrate's surface using, for example, focused ion beam, reactive particle or pin-hole etching processes. Once formed, the actual size of each surface feature is measured (e.g., using SEM) and then recorded. During a subsequent inspection tool calibration session, the reference substrate is scanned and waveform data corresponding to light reflected/scattered from each surface feature is correlated with the scanned feature's actual size data. During subsequent inspection procedures, the sizes of detected particles/defects are determined by matching detected particle/defect waveform data with corresponding surface feature waveform data.


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