The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 12, 2022

Filed:

Jun. 17, 2020
Applicant:

Applied Materials, Inc., Santa Clara, CA (US);

Inventors:

Mang-Mang Ling, San Jose, CA (US);

Thomas Kwon, Dublin, CA (US);

Jong Mun Kim, San Jose, CA (US);

Chentsau Chris Ying, Cupertino, CA (US);

Assignee:

Applied Materials, Inc., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C23C 16/04 (2006.01); C23C 16/26 (2006.01); H01L 27/11582 (2017.01); H01L 27/11556 (2017.01); H01L 27/1157 (2017.01); H01L 27/11524 (2017.01); C23C 14/35 (2006.01); C23C 14/04 (2006.01); C23C 16/511 (2006.01); C23C 14/58 (2006.01); C23C 14/06 (2006.01);
U.S. Cl.
CPC ...
C23C 16/042 (2013.01); C23C 16/26 (2013.01); H01L 27/1157 (2013.01); H01L 27/11524 (2013.01); H01L 27/11556 (2013.01); H01L 27/11582 (2013.01); C23C 14/042 (2013.01); C23C 14/0605 (2013.01); C23C 14/357 (2013.01); C23C 14/5873 (2013.01); C23C 16/511 (2013.01);
Abstract

Embodiments of the present disclosure generally relate to a method for forming an opening using a mask. In one embodiment, a method includes forming a mask on a feature layer. The method includes forming a first opening in the mask to expose a portion of the feature layer. The method further includes forming a carbon layer on the mask and the exposed portion of the feature layer. The method also includes removing portions of the carbon layer and a portion of the exposed portion of the feature layer in order to form a second opening in the feature layer.


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