The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 28, 2022

Filed:

Aug. 24, 2020
Applicant:

Applied Materials, Inc., Santa Clara, CA (US);

Inventors:

Sumit Agarwal, Dublin, CA (US);

Anantha K Subramani, San Jose, CA (US);

Yang Guo, Santa Clara, CA (US);

Siva Chandrasekar, Hosur, IN;

Assignee:

Applied Materials, Inc., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06K 9/62 (2022.01); C23C 16/52 (2006.01); C23C 16/455 (2006.01); G06N 20/00 (2019.01);
U.S. Cl.
CPC ...
C23C 16/52 (2013.01); C23C 16/45544 (2013.01); G06K 9/6256 (2013.01); G06K 9/6262 (2013.01); G06N 20/00 (2019.01);
Abstract

A method includes receiving one or more parameters associated with a plurality of metal plates. The method further includes determining, based on the one or more parameters, a plurality of predicted deformation values associated with the plurality of metal plates. Each of the plurality of predicted deformation values correspond to a corresponding metal plate of the plurality of metal plates. The method further includes causing, based on the plurality of predicted deformation values, the plurality of metal plates to be diffusion bonded to produce a bonded metal plate structure.


Find Patent Forward Citations

Loading…