The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 14, 2022

Filed:

Jan. 16, 2020
Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

Altug Koker, El Dorado Hills, CA (US);

Farshad Akhbari, Chandler, AZ (US);

Feng Chen, Shanghai, CN;

Dukhwan Kim, San Jose, CA (US);

Narayan Srinivasa, Portland, OR (US);

Nadathur Rajagopalan Satish, Santa Clara, CA (US);

Liwei Ma, Beijing, CN;

Jeremy Bottleson, Rancho Cordova, CA (US);

Eriko Nurvitadhi, Hillsboro, OR (US);

Joydeep Ray, Folsom, CA (US);

Ping T. Tang, Edison, NJ (US);

Michael S. Strickland, Sunnyvale, CA (US);

Xiaoming Chen, Shanghai, CN;

Tatiana Shpeisman, Menlo Park, CA (US);

Abhishek R. Appu, El Dorado Hills, CA (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06F 15/80 (2006.01); G06F 13/40 (2006.01); G06T 1/20 (2006.01); G06F 9/30 (2018.01); G06F 13/00 (2006.01); G06N 3/04 (2006.01); G06N 3/063 (2006.01); G06N 3/08 (2006.01);
U.S. Cl.
CPC ...
G06F 15/8007 (2013.01); G06F 9/3004 (2013.01); G06F 13/00 (2013.01); G06F 13/4027 (2013.01); G06N 3/0445 (2013.01); G06N 3/0454 (2013.01); G06N 3/0481 (2013.01); G06N 3/063 (2013.01); G06N 3/084 (2013.01); G06T 1/20 (2013.01);
Abstract

An integrated circuit (IC) package apparatus is disclosed. The IC package includes one or more processing units and a bridge, mounted below the one or more processing unit, including one or more arithmetic logic units (ALUs) to perform atomic operations.


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