The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 07, 2022

Filed:

Nov. 20, 2020
Applicant:

Tiveni Mergeco, Inc., San Mateo, CA (US);

Inventors:

Heiner Fees, Bietigheim-Bissingen, DE;

Andreas Track, Sachsenheim, DE;

Alexander Eichhorn, Eppingen, DE;

Ralf Maisch, Abstatt, DE;

Jörg Damaske, Freiberg, DE;

Martin Eberhard, Woodside, CA (US);

Assignee:

TIVENI MERGECO, INC., Redwood City, CA (US);

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01M 50/00 (2021.01); H01M 50/502 (2021.01); B23K 26/21 (2014.01); B60L 50/64 (2019.01); B60L 58/21 (2019.01); B60K 1/00 (2006.01); B60K 1/04 (2019.01); B62D 21/15 (2006.01); H01M 50/10 (2021.01); H01M 50/20 (2021.01); H01M 50/56 (2021.01); H01M 50/116 (2021.01); H01M 50/152 (2021.01); H01M 50/166 (2021.01); H01M 50/528 (2021.01); H01M 50/529 (2021.01); H01M 50/543 (2021.01); H01M 50/545 (2021.01); H01M 50/522 (2021.01); H01M 50/516 (2021.01); H01M 50/107 (2021.01); H01M 50/171 (2021.01); H01M 50/147 (2021.01); H01M 10/613 (2014.01); H01M 10/625 (2014.01); B23K 26/26 (2014.01); B23K 101/36 (2006.01); H01M 10/643 (2014.01); H01M 10/6552 (2014.01); B23K 101/38 (2006.01); B62D 21/18 (2006.01); F16M 1/00 (2006.01); H01M 50/572 (2021.01);
U.S. Cl.
CPC ...
H01M 50/502 (2021.01); B23K 26/21 (2015.10); B23K 26/26 (2013.01); B60K 1/00 (2013.01); B60K 1/04 (2013.01); B60L 50/64 (2019.02); B60L 58/21 (2019.02); B62D 21/152 (2013.01); B62D 21/155 (2013.01); H01M 10/613 (2015.04); H01M 10/625 (2015.04); H01M 50/10 (2021.01); H01M 50/107 (2021.01); H01M 50/116 (2021.01); H01M 50/147 (2021.01); H01M 50/152 (2021.01); H01M 50/166 (2021.01); H01M 50/171 (2021.01); H01M 50/20 (2021.01); H01M 50/516 (2021.01); H01M 50/522 (2021.01); H01M 50/528 (2021.01); H01M 50/529 (2021.01); H01M 50/543 (2021.01); H01M 50/545 (2021.01); H01M 50/56 (2021.01); B23K 2101/36 (2018.08); B23K 2101/38 (2018.08); B60K 2001/001 (2013.01); B60K 2001/005 (2013.01); B60K 2001/0438 (2013.01); B60K 2001/0461 (2013.01); B60Y 2306/01 (2013.01); B62D 21/18 (2013.01); F16M 1/00 (2013.01); H01M 10/643 (2015.04); H01M 10/6552 (2015.04); H01M 50/572 (2021.01); H01M 2200/103 (2013.01); H01M 2220/20 (2013.01);
Abstract

An embodiment is directed to a multi-layer contact plate configured to establish electrical bonds to battery cells in a battery module. The multi-layer contact plate includes two or more primary conductive layers (e.g., Al, Cu, etc.), and a cell terminal connection layer (e.g., steel, Al, Cu, etc.) that is joined with, and sandwiched by, the two or more primary conductive layers. A portion of the cell terminal connection layer is configured to form a set of bonding connectors (e.g., bonding ribbons) to provide a direct electrical bond between the multi-layer contact plate and terminals (e.g., positive terminals, negative terminals, or a combination thereof) of at least one group of battery cells (e.g., a single group of battery cells, two groups of battery cells that are connected in series, etc.).


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