The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 07, 2022
Filed:
Jul. 01, 2016
Intel Corporation, Santa Clara, CA (US);
Howe Yin Loo, Sungai Petani, MY;
Sujit Sharan, Chandler, AZ (US);
Tin Poay Chuah, Bayan Lepas, MY;
Ananth Prabhakumar, Chandler, AZ (US);
Intel Corporation, Santa Clara, CA (US);
Abstract
Techniques and mechanisms to facilitate connectivity between circuit components via a substrate. In an embodiment, a microelectronic device includes a substrate, wherein a recess region extends from the first side of the substrate and only partially toward a second side of the substrate. First input/output (IO) contacts of a first hardware interface are disposed in the recess region. The first IO contacts are variously coupled to each to a respective metallization layer of the substrate, wherein the recess region extends though one or more other metallization layers of the substrate. In another embodiment, the microelectronic device further comprises second IO contacts of a second hardware interface, the second IO contacts to couple the microelectronic device to a printed circuit board.