The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 24, 2022

Filed:

Nov. 13, 2019
Applicant:

Tiveni Mergeco, Inc., San Mateo, CA (US);

Inventors:

Heiner Fees, Bietigheim-Bissingen, DE;

Andreas Track, Sachsenheim, DE;

Alexander Eichhorn, Eppingen, DE;

Ralf Maisch, Abstatt, DE;

Jörg Damaske, Freiberg, DE;

Martin Eberhard, Woodside, CA (US);

Assignee:

TIVENI MERGECO, INC., Redwood City, CA (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01M 50/502 (2021.01); H01M 50/20 (2021.01); H01M 50/543 (2021.01); H01M 50/522 (2021.01); H01M 50/516 (2021.01); H01M 50/545 (2021.01); B23K 26/21 (2014.01); B60L 50/64 (2019.01); B60L 58/21 (2019.01); B60K 1/00 (2006.01); B60K 1/04 (2019.01); B62D 21/15 (2006.01); H01M 50/10 (2021.01); H01M 50/56 (2021.01); H01M 50/116 (2021.01); H01M 50/152 (2021.01); H01M 50/166 (2021.01); H01M 50/528 (2021.01); H01M 50/529 (2021.01); H01M 50/107 (2021.01); H01M 50/171 (2021.01); H01M 50/147 (2021.01); H01M 10/613 (2014.01); H01M 10/625 (2014.01); B23K 26/26 (2014.01); B23K 101/36 (2006.01); H01M 10/643 (2014.01); H01M 10/6552 (2014.01); B23K 101/38 (2006.01); B62D 21/18 (2006.01); F16M 1/00 (2006.01); H01M 50/572 (2021.01);
U.S. Cl.
CPC ...
H01M 50/502 (2021.01); B23K 26/21 (2015.10); B23K 26/26 (2013.01); B60K 1/00 (2013.01); B60K 1/04 (2013.01); B60L 50/64 (2019.02); B60L 58/21 (2019.02); B62D 21/152 (2013.01); B62D 21/155 (2013.01); H01M 10/613 (2015.04); H01M 10/625 (2015.04); H01M 50/10 (2021.01); H01M 50/107 (2021.01); H01M 50/116 (2021.01); H01M 50/147 (2021.01); H01M 50/152 (2021.01); H01M 50/166 (2021.01); H01M 50/171 (2021.01); H01M 50/20 (2021.01); H01M 50/516 (2021.01); H01M 50/522 (2021.01); H01M 50/528 (2021.01); H01M 50/529 (2021.01); H01M 50/543 (2021.01); H01M 50/545 (2021.01); H01M 50/56 (2021.01); B23K 2101/36 (2018.08); B23K 2101/38 (2018.08); B60K 2001/001 (2013.01); B60K 2001/005 (2013.01); B60K 2001/0438 (2013.01); B60K 2001/0461 (2013.01); B60Y 2306/01 (2013.01); B62D 21/18 (2013.01); F16M 1/00 (2013.01); H01M 10/643 (2015.04); H01M 10/6552 (2015.04); H01M 50/572 (2021.01); H01M 2200/103 (2013.01); H01M 2220/20 (2013.01);
Abstract

Embodiments are directed to contact plates configured to establish electrical bonds between battery cells in a battery module. In a first embodiment, the contact plate includes at least one primary conductive layer including a hole that is aligned with two or more terminals of two or more battery cells in a group of battery cells that are configured to be connected in parallel with each other, and a bonding connector configured to provide direct electrical bonds between the contact plate and the two or more terminals of the two or more battery cells. In a second embodiment, a contact plate includes at least one primary conductive layer and a set of bonding connectors made from at least one material that is selected to match at least one material used for the terminals of the at least one group of battery cells.


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