The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 24, 2022

Filed:

Mar. 16, 2020
Applicant:

Qualcomm Incorporated, San Diego, CA (US);

Inventors:

Joan Rey Villarba Buot, Escondido, CA (US);

Kuiwon Kang, San Diego, CA (US);

Joonsuk Park, San Diego, CA (US);

Karthikeyan Dhandapani, San Diego, CA (US);

Assignee:

QUALCOMM Incorporated, San Diego, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/03 (2006.01); H05K 1/11 (2006.01); H01L 23/498 (2006.01); H01L 21/48 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49822 (2013.01); H01L 21/486 (2013.01); H01L 21/4857 (2013.01); H01L 23/49827 (2013.01); H01L 23/49838 (2013.01); H01L 23/49894 (2013.01); H05K 1/0306 (2013.01); H05K 1/11 (2013.01); H05K 1/112 (2013.01); H05K 1/036 (2013.01);
Abstract

Certain aspects of the present disclosure generally relate to an embedded trace substrate having at least two different dielectric layers with different dielectric materials and methods for fabricating the same. One example embedded trace substrate generally includes a first metal layer; a first dielectric layer disposed below the first metal layer and comprising a first dielectric material; a second dielectric layer disposed below the first dielectric layer and comprising a second dielectric material, wherein the second dielectric material of the second dielectric layer is stiffer than the first dielectric material of the first dielectric layer; and a second metal layer disposed below the second dielectric layer.


Find Patent Forward Citations

Buot, Joan Rey Villarba. (2022). Multi-dielectric structure in two-layer embedded trace substrate (U.S. Patent No. 11342254). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11342254

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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