The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 24, 2022
Filed:
Mar. 19, 2018
Applicant:
Tokyo Electron Limited, Tokyo, JP;
Inventors:
Assignee:
TOKYO ELECTRON LIMITED, Tokyo, JP;
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/311 (2006.01); H01L 21/02 (2006.01);
U.S. Cl.
CPC ...
H01L 21/31116 (2013.01); H01L 21/02164 (2013.01); H01L 21/02205 (2013.01); H01L 21/02532 (2013.01);
Abstract
A technique for making etching amounts uniform in selectively etching SiGe layers formed on a wafer with respect to at least one of an Si layer, an SiOlayer, and an SiN layer is provided. In an etching process where SiGe layers in a wafer W in which the SiGe layers and Si layers are alternately stacked and exposed in a recess are removed by side etching, ClFgas and HF gas are simultaneously supplied to the wafer W. Accordingly, it is possible to make the etching rates for respective SiGe layers uniform, and it becomes possible to obtain a uniform etching amount for respective SiGe layers.