The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 10, 2022
Filed:
Sep. 22, 2020
Taiwan Semiconductor Manufacturing Company Ltd., Hsinchu, TW;
Chen-Shien Chen, Hsinchu County, TW;
Ming-Da Cheng, Taoyuan, TW;
Ming-Chih Yew, Hsinchu, TW;
Yu-Tse Su, Chiayi, TW;
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD., Hsinchu, TW;
Abstract
A method for manufacturing a semiconductor package includes following operations. A die having a first surface and a second surface opposite to the first surface is provided. A polymeric film is disposed over the second surface of the die. An adhesive film is provided. The die and the polymeric film are attached to a carrier substrate through the adhesive film. The die, the polymeric film and the adhesive film are molded with a molding compound. The polymeric film is sandwiched between the die and the adhesive film upon attaching to the carrier substrate.