The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 03, 2022

Filed:

Jul. 28, 2020
Applicant:

Hefechip Corporation Limited, Sai Ying Pun, HK;

Inventors:

Geeng-Chuan Chern, Cupertino, CA (US);

Liang-Choo Hsia, Hsinchu, TW;

Assignee:

HeFeChip Corporation Limited, Sai Ying Pun, HK;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/108 (2006.01); H01L 21/311 (2006.01);
U.S. Cl.
CPC ...
H01L 27/10852 (2013.01); H01L 27/10814 (2013.01); H01L 21/31111 (2013.01);
Abstract

A stacked capacitor includes a substrate having a first ILD layer thereon and a source conductive plate in the first ILD layer; a second ILD layer disposed on the first ILD layer; and a stacked capacitor area in the second ILD layer. The stacked capacitor area partially exposes the source conductive plate. A fin-shaped structure is disposed on the source conductive plate within the stacked capacitor area. The fin-shaped structure includes horizontal fins and vertical fins. A widened central hole penetrates through the fin-shaped structure and partially exposes the source conductive plate. A first conductive layer is disposed on the fin-shaped structure and the source conductive plate in the widened central hole. A capacitor dielectric layer is disposed on the first conductive layer. A second conductive layer is disposed on the capacitor dielectric layer.


Find Patent Forward Citations

Loading…