The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 03, 2022

Filed:

Dec. 18, 2018
Applicant:

Murata Manufacturing Co., Ltd., Kyoto, JP;

Inventors:

Takayuki Tsutsui, Kyoto, JP;

Isao Obu, Kyoto, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/66 (2006.01); H01L 23/528 (2006.01); H01L 23/00 (2006.01); H01L 49/02 (2006.01); H01L 29/737 (2006.01); H03F 3/217 (2006.01); H01L 27/06 (2006.01); H01L 23/538 (2006.01); H03F 1/56 (2006.01); H03F 3/195 (2006.01); H03H 7/38 (2006.01);
U.S. Cl.
CPC ...
H01L 23/66 (2013.01); H01L 23/5286 (2013.01); H01L 23/5381 (2013.01); H01L 24/13 (2013.01); H01L 24/14 (2013.01); H01L 27/0658 (2013.01); H01L 28/10 (2013.01); H01L 28/40 (2013.01); H01L 29/7371 (2013.01); H03F 3/2178 (2013.01); H01L 2223/6655 (2013.01); H01L 2224/13025 (2013.01); H01L 2224/13082 (2013.01); H01L 2224/13101 (2013.01); H01L 2224/13147 (2013.01); H01L 2224/14515 (2013.01); H01L 2924/1304 (2013.01); H01L 2924/1306 (2013.01); H01L 2924/30111 (2013.01); H03F 1/565 (2013.01); H03F 3/195 (2013.01); H03F 2200/222 (2013.01); H03F 2200/387 (2013.01); H03F 2200/451 (2013.01); H03H 7/38 (2013.01);
Abstract

A plurality of unit transistors that are connected in parallel to each other are formed on a substrate. In addition, a ground bump is provided on the substrate. A plurality of first capacitors are each provided for a corresponding one of the plurality of unit transistors and each connect an output electrode of the corresponding one of the plurality of unit transistors and the ground bump to each other.


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