The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 26, 2022

Filed:

Feb. 08, 2019
Applicant:

Hitachi High-tech Corporation, Tokyo, JP;

Inventors:

Takamasa Ichino, Tokyo, JP;

Kohei Sato, Tokyo, JP;

Kazunori Nakamoto, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01J 37/32 (2006.01);
U.S. Cl.
CPC ...
H01J 37/32183 (2013.01); H01J 37/3211 (2013.01); H01J 37/3244 (2013.01); H01J 37/32577 (2013.01); H01J 37/32642 (2013.01); H01J 37/32715 (2013.01);
Abstract

A plasma processing apparatus includes a processing chamber in which a waferis processed by using plasma, a radio-frequency power supply that supplies radio-frequency power for generating the plasma, a sample tablewhich is arranged in the processing chamber and in which the waferis mounted, and a DC power supplywhich is electrically connected to the sample tableand which causes the sample tableto generate a suction force. The sample tableincludes a protruded portionthat sucks the waferby the suction force and a level different portionprotruding from a lower portion of the protruded portionA ringthat can be in contact with a lower surface of the waferis provided outside the protruded portionA space portionformed by the waferthe protruded portionand the ringis sealed in a state in which the waferis sucked to an upper surface of the protruded portionof the sample table


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