The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 26, 2022

Filed:

Sep. 25, 2020
Applicant:

Synopsys, Inc., Mountain View, CA (US);

Inventors:

Lawrence S. Melvin, III, Hillsboro, OR (US);

Yudhishthir Prasad Kandel, Durham, NC (US);

Qiliang Yan, Portland, OR (US);

Ulrich Karl Klostermann, Munich, DE;

Assignee:

Synopsys, Inc., Mountain View, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G03F 7/20 (2006.01); G03F 9/00 (2006.01);
U.S. Cl.
CPC ...
G03F 7/70441 (2013.01); G03F 7/705 (2013.01); G03F 7/70283 (2013.01); G03F 9/7026 (2013.01);
Abstract

Certain aspects relate to a method for improving a lithography configuration. In the lithography configuration, a source illuminates a mask to expose resist on a wafer. A processor determines a defect-based focus exposure window (FEW). The defect-based FEW is an area of depth of focus and exposure latitude for the lithography configuration with an acceptable level of defects on the wafer. The defect-based FEW is determined based on a predicted probability distribution for occurrence of defects on the wafer. A processor also determines a critical dimension (CD)-based FEW. The CD-based FEW is an area of depth of focus and exposure latitude for the lithography configuration with an acceptable level of CD variation on the wafer. It is determined based on predicted CDs on the wafer. The lithography configuration is modified based on increasing an area of overlap between the defect-based FEW and the CD-based FEW.


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