The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 29, 2022

Filed:

May. 28, 2020
Applicant:

Taiwan Semiconductor Manufacturing Company Limited, Hsinchu, TW;

Inventors:

Min-Yung Ko, Hsinchu, TW;

Shih-Chang Liu, Alian Township, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G11C 11/16 (2006.01); H01L 43/02 (2006.01); H01L 27/22 (2006.01);
U.S. Cl.
CPC ...
H01L 27/228 (2013.01); G11C 11/161 (2013.01); H01L 43/02 (2013.01);
Abstract

Pillar stacks of a top electrode and a hard mask portion are formed over a layer stack containing a continuous reference magnetization layer, a continuous nonmagnetic tunnel barrier layer, and a continuous free magnetization layer. A continuous dielectric liner may be deposited and anisotropically etched to form inner dielectric spacers. The continuous free magnetization layer, the continuous nonmagnetic tunnel barrier layer, and the continuous reference magnetization layer may be anisotropically etched to form vertical stacks of a respective reference magnetization layer, a respective nonmagnetic tunnel barrier layer, and a respective free magnetization layer, which are magnetic tunnel junctions. The inner dielectric spacers prevent redeposition of a metallic material of the hard mask portions on sidewalls of the magnetic tunnel junctions. The hard mask portions may be removed, and a metallic cell contact structures may be formed on top of each top electrode.


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