The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 29, 2022
Filed:
Apr. 20, 2020
Applicant:
Globalfoundries U.s. Inc., Santa Clara, CA (US);
Inventors:
Man Gu, Malta, NY (US);
Wang Zheng, Ballston Lake, NY (US);
Teng-Yin Lin, Clifton Park, NY (US);
Halting Wang, Clifton Park, NY (US);
Tung-Hsing Lee, Clifton Park, NY (US);
Assignee:
GlobalFoundries U.S. Inc., Santa Clara, CA (US);
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 27/11 (2006.01); H01L 27/06 (2006.01); H01L 29/78 (2006.01); H01L 49/02 (2006.01); H01L 23/66 (2006.01); H01P 3/06 (2006.01);
U.S. Cl.
CPC ...
H01L 27/0629 (2013.01); H01L 23/66 (2013.01); H01L 28/10 (2013.01); H01L 28/24 (2013.01); H01L 29/7851 (2013.01); H01P 3/06 (2013.01); H01L 2223/6627 (2013.01);
Abstract
Structures including a passive device and methods of forming such structures. Multiple fins are positioned on a substrate, and an interconnect structure is positioned over the substrate. The fins contain a polycrystalline semiconductor material, and the interconnect structure includes a passive device that is positioned over the fins. The passive device may be, for example, an inductor or a transmission line.