The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 29, 2022
Filed:
Jun. 18, 2020
Murata Manufacturing Co., Ltd., Kyoto-fu, JP;
Shigeki Koya, Nagaokakyo, JP;
Yasunari Umemoto, Nagaokakyo, JP;
Isao Obu, Nagaokakyo, JP;
Masao Kondo, Nagaokakyo, JP;
Yuichi Saito, Nagaokakyo, JP;
Takayuki Tsutsui, Nagaokakyo, JP;
Murata Manufacturing Co., Ltd., Kyoto-fu, JP;
Abstract
A semiconductor element includes a semiconductor substrate, first and second amplifiers provided on the semiconductor substrate and adjacently provided in a first direction, a first reference potential bump provided on a main surface of the semiconductor substrate, and connecting the first amplifier and a reference potential, a second reference potential bump provided on the main surface, being adjacent to the first reference potential bump in the first direction, and connecting the second amplifier and a reference potential, and a rectangular bump provided on the main surface, provided between the first and second reference potential bumps in a plan view, and formed such that a second width in a second direction orthogonal to the first direction is larger than a first width in the first direction. The second width is larger than a width of at least one of the first and second reference potential bumps in the second direction.