The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 29, 2022

Filed:

Dec. 26, 2017
Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

Sai Vadlamani, Chandler, AZ (US);

Prithwish Chatterjee, Tempe, AZ (US);

Lauren A. Link, Chandler, AZ (US);

Andrew J. Brown, Chandler, AZ (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01F 27/28 (2006.01); H01L 23/522 (2006.01); H01L 49/02 (2006.01); H01L 23/538 (2006.01); H01F 17/00 (2006.01); H01L 21/768 (2006.01);
U.S. Cl.
CPC ...
H01F 27/2828 (2013.01); H01F 17/0006 (2013.01); H01L 23/5227 (2013.01); H01L 23/5383 (2013.01); H01L 28/10 (2013.01); H01F 2017/0066 (2013.01); H01F 2017/0086 (2013.01); H01L 21/76802 (2013.01);
Abstract

An electronic structure may be fabricated comprising an electronic substrate having at least one photo-imageable dielectric layer and an inductor embedded in the electronic substrate, wherein the inductor comprises a magnetic material layer disposed within a via formed in the at least one photo-imageable dielectric layer and an electrically conductive via extending through the magnetic material layer. The electronic structure may further include an integrated circuit device attached to the electronic substrate and the electronic substrate may further be attached to a board, such as a motherboard.


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