The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 22, 2022
Filed:
Jun. 25, 2020
Applicant:
Samsung Electronics Co., Ltd., Suwon-si, KR;
Inventors:
Eunsung Seo, Hwaseong-si, KR;
Chang Gil Kwon, Anseong-si, KR;
Sung Pyo Lee, Anseong-si, KR;
Dongchan Kim, Seongnam-si, KR;
Bo Yun Kim, Hwaseong-si, KR;
Jun Ha Hwang, Anseong-si, KR;
Assignees:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09G 1/18 (2006.01); H01L 21/321 (2006.01); C09G 1/02 (2006.01); H01L 21/306 (2006.01); B24B 1/00 (2006.01); H01L 21/304 (2006.01); C09G 1/00 (2006.01);
U.S. Cl.
CPC ...
C09G 1/18 (2013.01); B24B 1/00 (2013.01); C09G 1/00 (2013.01); C09G 1/02 (2013.01); H01L 21/304 (2013.01); H01L 21/30625 (2013.01); H01L 21/3212 (2013.01);
Abstract
Described herein are chemical mechanical polishing (CMP) slurry compositions, such as CMP slurry compositions for polishing an indium tin oxide (ITO) layer, along with methods of fabricating a semiconductor device using such a CMP slurry composition. The CMP slurry composition can include a polishing particle, a dispersing agent, an auxiliary oxidizing agent, and a sugar alcohol compound.