The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 15, 2022
Filed:
Nov. 27, 2019
Semiconductor device package having a core substrate and an embedded component in the core substrate
Advanced Semiconductor Engineering, Inc., Kaohsiung, TW;
Chih Cheng Lee, Kaohsiung, TW;
ADVANCED SEMICONDUCTOR ENGINEERING, INC., Kaohsiung, TW;
Abstract
A semiconductor device package includes an electronic component, a first passivation layer having an inner surface surrounding the electronic component, and a conductive layer disposed on the inner surface of the first passivation layer. The electronic component has a first surface, a second surface opposite the first surface, and a lateral surface extended between the first surface and the second surface. The conductive layer has a relatively rough surface. A method of manufacturing a semiconductor device package is also disclosed.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile