The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 15, 2022

Filed:

Nov. 12, 2019
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Junli Wang, Slingerlands, NY (US);

Alexander Reznicek, Troy, NY (US);

Shogo Mochizuki, Clifton Park, NY (US);

Joshua Rubin, Albany, NY (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/786 (2006.01); H01L 27/092 (2006.01); H01L 21/28 (2006.01); H01L 27/088 (2006.01); H01L 21/3213 (2006.01); H01L 29/423 (2006.01); H01L 29/51 (2006.01); H01L 29/66 (2006.01); H01L 29/49 (2006.01); H01L 29/775 (2006.01);
U.S. Cl.
CPC ...
H01L 21/28088 (2013.01); H01L 21/32134 (2013.01); H01L 27/0886 (2013.01); H01L 27/092 (2013.01); H01L 29/42392 (2013.01); H01L 29/4908 (2013.01); H01L 29/511 (2013.01); H01L 29/66439 (2013.01); H01L 29/66545 (2013.01); H01L 29/66742 (2013.01); H01L 29/66772 (2013.01); H01L 29/775 (2013.01); H01L 29/78696 (2013.01);
Abstract

A method of forming gate structures to a nanosheet device that includes forming at least two stacks of nanosheets, wherein each nanosheet includes a channel region portion having a gate dielectric layer present thereon. The method may further include forming a dual metal layer scheme on the gate dielectric layer of each nanosheet. The dual metal layer scheme including an etch stop layer of a first composition and a work function adjusting layer of a second composition, wherein the etch stop layer has a composition that provides that the work function adjusting layer is removable by a wet etch chemistry that is selective to the etch stop layer.


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