The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 08, 2022

Filed:

Feb. 03, 2020
Applicant:

Stmicroelectronics S.r.l., Agrate Brianza, IT;

Inventors:

Mario Giuseppe Saggio, Aci Bonaccorsi, IT;

Simone Rascuná, San Giovanni la Punta, IT;

Assignee:

STMICROELECTRONICS S.R.L., Agrate Brianza, IT;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/808 (2006.01); H01L 27/06 (2006.01); H01L 29/872 (2006.01); H01L 29/06 (2006.01); H01L 29/10 (2006.01); H01L 29/16 (2006.01); H01L 29/66 (2006.01); H01L 29/78 (2006.01); H01L 21/04 (2006.01); H01L 29/08 (2006.01); H01L 29/423 (2006.01);
U.S. Cl.
CPC ...
H01L 27/0629 (2013.01); H01L 21/046 (2013.01); H01L 29/0619 (2013.01); H01L 29/0696 (2013.01); H01L 29/0847 (2013.01); H01L 29/1095 (2013.01); H01L 29/1608 (2013.01); H01L 29/4238 (2013.01); H01L 29/66068 (2013.01); H01L 29/7806 (2013.01); H01L 29/872 (2013.01);
Abstract

An integrated MOSFET device is formed in a body of silicon carbide and with a first type of conductivity. The body accommodates a first body region, with a second type of conductivity; a JFET region adjacent to the first body region; a first source region, with the first type of conductivity, extending into the interior of the first body region; an implanted structure, with the second type of conductivity, extending into the interior of the JFET region. An isolated gate structure lies partially over the first body region, the first source region and the JFET region. A first metallization layer extends over the first surface and forms, in direct contact with the implanted structure and with the JFET region, a JBS diode.


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