The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 08, 2022

Filed:

May. 16, 2019
Applicant:

Kla-tencor Corporation, Milpitas, CA (US);

Inventors:

Gildardo R Delgado, Livermore, CA (US);

Shannon B Hill, Hayward, CA (US);

Zefram Marks, Fremont, CA (US);

Assignee:

KLA-TENCOR CORPORATION, Milpitas, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/146 (2006.01); G01N 21/95 (2006.01); G03F 7/16 (2006.01); H01L 31/0216 (2014.01);
U.S. Cl.
CPC ...
G01N 21/9501 (2013.01); G03F 7/16 (2013.01); H01L 27/1462 (2013.01); H01L 27/14685 (2013.01); H01L 31/0216 (2013.01);
Abstract

Disclosed herein are optical elements and methods for making the same. Such optical elements may comprise a first layer disposed on a substrate, a second layer disposed on the first layer, a terminal layer disposed on the second layer, and a cap layer disposed on the terminal layer. The cap layer may comprise boron, boron nitride, or boron carbide. Such optical elements may be made using a method comprising depositing a first layer using vapor deposition such that the first layer is disposed on a substrate, depositing a second layer using vapor deposition such that the second layer is disposed on the first layer, depositing a terminal layer using vapor deposition such that the terminal layer is disposed on the second layer, and depositing a cap layer comprising boron, boron nitride, or boron carbide using vapor deposition such that the cap layer is disposed on the terminal layer.


Find Patent Forward Citations

Loading…