The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 01, 2022

Filed:

Oct. 18, 2019
Applicant:

Shanghai Huahong Grace Semiconductor Manufacturing Corporation, Shanghai, CN;

Inventor:

Wensheng Qian, Shanghai, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/78 (2006.01); H01L 29/10 (2006.01); H01L 29/40 (2006.01); H01L 29/66 (2006.01); H01L 21/265 (2006.01); H01L 21/324 (2006.01);
U.S. Cl.
CPC ...
H01L 29/7816 (2013.01); H01L 21/26513 (2013.01); H01L 21/26586 (2013.01); H01L 21/324 (2013.01); H01L 29/1083 (2013.01); H01L 29/1095 (2013.01); H01L 29/408 (2013.01); H01L 29/6659 (2013.01); H01L 29/66537 (2013.01); H01L 29/66681 (2013.01); H01L 29/7835 (2013.01);
Abstract

Disclosed is an LDMOS device comprising a drift region formed by a selected area of a doped layer of a first conductivity type on a semiconductor substrate, a gate structure comprising a gate dielectric layer and a gate conductive layer which are sequentially formed on a surface of the doped layer of the first conductivity type, a doped self-aligned channel region of a second conductivity type, and a doped layer formed by tilted ion implantation with a first side face of the gate structure as a self-alignment condition. A method for manufacturing an LDMOS device is further disclosed. The channel length is not affected by lithography and thus can be minimized to fulfill an ultralow specific-on-resistance, and the distribution uniformity of the channel length can be improved, so that the performance uniformity of the device is improved.


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