The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 22, 2022

Filed:

Jan. 12, 2021
Applicant:

Micron Technology, Inc., Boise, ID (US);

Inventors:

Aswin Thiruvengadam, Folsom, CA (US);

Sivagnanam Parthasarathy, Carlsbad, CA (US);

Daniel Scobee, Ione, CA (US);

Frederick Jensen, El Dorado Hills, CA (US);

Assignee:

Micron Technology, Inc., Boise, ID (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G11C 29/38 (2006.01); G11C 29/36 (2006.01); G06F 12/16 (2006.01); G06F 3/06 (2006.01); G06F 11/10 (2006.01); G06F 11/16 (2006.01);
U.S. Cl.
CPC ...
G11C 29/38 (2013.01); G06F 3/0679 (2013.01); G06F 3/0688 (2013.01); G06F 11/1016 (2013.01); G06F 11/167 (2013.01); G06F 12/16 (2013.01); G11C 29/36 (2013.01);
Abstract

Filter information including a first temperature level and a second temperature level associated with a test process to be executed on one or more memory components is determined. Information associated with the test process is distributed to a first test component including a first set of memory components and a first temperature control component and a second test component including a second set of memory components and a second temperature control component. First feedback information associated with execution of the test process by the first test component at the first temperature level established by the first temperature control component is received. Second feedback information associated with execution of the test process by the second test component at the second temperature level established by the second temperature control component is received. Based on at least one of the first feedback information or the second feedback information, a failure of the test process executed using at least one of the first temperature level or the second temperature level is determined.


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