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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11256180 B1

PDFFull Text
Date of Patent:
Feb. 22, 2022

Filed:

Apr. 29, 2019

Processing apparatus and method thereof

Applicant:

Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;

Inventors:

Fu-Chun Hsieh, Hsinchu, TW;

Pei-Yi Su, Taichung, TW;

Chih-Che Lin, Hsinchu County, TW;

Assignee:

TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD., Hsinchu, TW;

Attorney:

Maschoff Brennan

Primary Examiner:

Peter B Kim

Int. Cl.
CPC ...
G03F 7/20 (2006.01); G03F 7/16 (2006.01); G03F 7/32 (2006.01); G03F 7/11 (2006.01); G03F 7/038 (2006.01); G03F 7/039 (2006.01); G03F 7/30 (2006.01);
U.S. Cl.
CPC ...
G03F 7/70925 (2013.01); G03F 7/038 (2013.01); G03F 7/039 (2013.01); G03F 7/0382 (2013.01); G03F 7/0392 (2013.01); G03F 7/11 (2013.01); G03F 7/162 (2013.01); G03F 7/168 (2013.01); G03F 7/2002 (2013.01); G03F 7/2004 (2013.01); G03F 7/3021 (2013.01); G03F 7/322 (2013.01);
Abstract

A method includes transferring a wafer into a first processing chamber by using a robot arm mechanism, and applying a photoresist on the wafer in a first processing chamber. The wafer is transferred from the first processing chamber into a second processing chamber by using the robot arm mechanism, and the photoresist is exposed to a pattern of light in the second processing chamber. The method includes transferring the wafer from the second processing chamber into a third processing chamber by using the robot arm mechanism, and developing the exposed wafer in the third processing chamber. The method includes cleaning the robot arm mechanism in a dummy chamber.

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