The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 15, 2022
Filed:
Jan. 27, 2020
Applicant:
Applied Materials, Inc., Santa Clara, CA (US);
Inventors:
Lin Xue, San Diego, CA (US);
Chi Hong Ching, Santa Clara, CA (US);
Jaesoo Ahn, San Jose, CA (US);
Mahendra Pakala, Santa Clara, CA (US);
Rongjun Wang, Dublin, CA (US);
Assignee:
Applied Materials, Inc., Santa Clara, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/22 (2006.01); H01L 43/08 (2006.01); G11C 11/16 (2006.01); G11C 11/15 (2006.01); H01L 21/768 (2006.01); H01L 45/00 (2006.01); H01L 27/24 (2006.01); G11B 5/31 (2006.01); G11B 5/39 (2006.01);
U.S. Cl.
CPC ...
H01L 43/08 (2013.01); G11C 11/15 (2013.01); G11C 11/161 (2013.01); H01L 21/76886 (2013.01); H01L 27/222 (2013.01); G11B 5/313 (2013.01); G11B 5/3909 (2013.01); G11B 5/3932 (2013.01); H01L 27/24 (2013.01); H01L 45/04 (2013.01); H01L 2924/1443 (2013.01);
Abstract
Embodiments herein provide film stacks that include a buffer layer; a synthetic ferrimagnet (SyF) coupling layer; and a capping layer, wherein the capping layer comprises one or more layers, and wherein the capping layer, the buffer layer, the SyF coupling layer, or a combination thereof, is not fabricated from Ru.