The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 15, 2022

Filed:

Jul. 23, 2020
Applicant:

United Microelectronics Corp., Hsin-Chu, TW;

Inventors:

Zhi-Cheng Lee, Tainan, TW;

Kai-Lin Lee, Kinmen County, TW;

Wei-Jen Chen, Tainan, TW;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 29/423 (2006.01); H01L 29/40 (2006.01); H01L 29/49 (2006.01); H01L 29/66 (2006.01);
U.S. Cl.
CPC ...
H01L 29/42376 (2013.01); H01L 29/401 (2013.01); H01L 29/4983 (2013.01); H01L 29/66545 (2013.01); H01L 29/66553 (2013.01); H01L 29/4966 (2013.01);
Abstract

A high voltage transistor structure includes a substrate. A metal gate is disposed on the substrate. At least one insulating material structure penetrates the metal gate. A metal compound layer is disposed between the metal gate and the substrate, between the insulating material structure and the substrate. The metal compound layer is a continuous structure. Agate dielectric layer is disposed under the metal compound layer and contacts the substrate.


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