The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 15, 2022
Filed:
Feb. 14, 2020
Applicant:
Asm Ip Holding B.v., Almere, NL;
Inventors:
SeungHwan Lee, Anseong-si, KR;
HakYong Kwon, Hwaseong-si, KR;
KiKang Kim, Yongin-si, KR;
SungBae Kim, Cheonan-si, KR;
JongHyun Ahn, Gyeonggi-do, KR;
SeongRyeong Kim, Hwaseong-si, KR;
Assignee:
ASM IP Holding B.V., Almere, NL;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/02 (2006.01); C23C 16/455 (2006.01); H01L 21/762 (2006.01);
U.S. Cl.
CPC ...
H01L 21/02301 (2013.01); C23C 16/45536 (2013.01); C23C 16/45553 (2013.01); H01L 21/0217 (2013.01); H01L 21/0228 (2013.01); H01L 21/02211 (2013.01); H01L 21/76224 (2013.01);
Abstract
A method and apparatus for depositing a material on a surface of a substrate are disclosed. The method can include a treatment step to suppress a rate of material deposition on the surface of the substrate. The method can result in higher-quality deposited material. Additionally or alternatively, the method can be used to fill a recess within the surface of the substrate with reduced or no seam formation.